Products/Services for BGA rom 102 chip
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MASK ROM (MROM) - (17 companies)MASK ROM (MROM) chips contain software (a mask) that is burned onto the chip during the semiconductor manufacturing process. Mask ROM (MROM) chips contain a software mask that is burned onto the chip during the design phase of the semiconductor... Learn More -
Memory Chips - (505 companies)Memory chips are internal storage areas in computers. Although the term "memory chip" commonly refers to a computer's random access memory (RAM), this product area includes many different types of electronic data storage. Computer memory stores data... Search by Specification | Learn More -
Chip Inductors - (151 companies)Chip inductors are manufactured using semiconductor material. General specifications, performance specifications and features are all important parameters to consider when searching for chip inductors. General specifications that are important... Search by Specification | Learn More -
System on a Chip (SoC) - (72 companies)System on a chip (SoC) devices are semiconductor chips with embedded components that make the chip a standalone system. System on a chip (SoC) devices are semiconductor chips with embedded components that enable the chip to function as standalone... Learn More -
Chip Capacitors - (174 companies)Chip capacitors or surface mount capacitors do not have leads. They are used in aerospace, automotive, general-purpose, high voltage, high frequency, microwave, and telecommunication applications. Most chip capacitors are packed in tape reel... Search by Specification | Learn More -
xDSL Chips - (18 companies)...xDSL chips provide digital subscriber line (DSL) connectivity in a system-on-chip platform. The term xDSL refers collectively to all types of digital subscriber lines. An xDSL chip is a generic term for all forms of DSL service spanning transmission... Learn More
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LAN Chips - (49 companies)LAN chips provide wireless local area network (LAN) connectivity in a system-on-chip platform. A LAN chip is a device on an Ethernet network that broadcasts information and provides Ethernet functions, including PHYceivers and media access control... Search by Specification | Learn More
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Chip Antennas - (36 companies)Chip antennas are semiconductor ICs used to collect or radiate electromagnetic waves. Chip antennas are semiconductor integrated circuits (IC) used to collect or radiate electromagnetic waves. Chip antennas are widely used in wireless communication... Search by Specification | Learn More
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Chip Resistors - (166 companies)Chip resistors are passive resistors with a form factor of an integrated circuit (IC) chip. Typically, they are manufactured using thin-film technology. There are two basic configurations for chip resistors: single resistor and resistor chip array... Search by Specification | Learn More
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FLASH Memory Chips - (191 companies)...transceiver logic plus (GTLP) are also available. Flash memory chips are available in a variety of IC package types and with different numbers of pins and flip-flops. Basic IC package types include ball grid array (BGA), quad flat package (QFP), single... Search by Specification | Learn More
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Sensor Interface Chips - (29 companies)...for integrated circuit. Sensor interface chips are integrated circuits (IC) that may also provide signal compensation and temperature correction in a variety of sensors. A sensor interface IC chip is used in many industries, including automotive, robotics... Search by Specification | Learn More
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GPS Chips - (50 companies)...navigation on land, sea, and air around the world, as well as an important tool for map-making, and land surveying. GPS chips consist of a GPS receiver chip and a GPS tracking chip. A GPS receiver chip calculates current position (latitude, longitude... Search by Specification | Learn More
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Smart Card Chips - (28 companies)...and notebook computers. They plug into a 68-pin host socket that is connected either to the motherboard or an expansion bus. Inter-IC (I2C) is a multi-master interface that allows multiple chips to be connected to the same bus with each chip acting... Search by Specification | Learn More
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Lab-on-a-Chip (LOC) Devices - (17 companies)Lab-on-a-chip (LOC) devices are integrated semiconductors that serve as a laboratory for the testing and analysis of very small chemical and clinical samples. Lab-on-a-chip (LOC) devices are integrated semiconductor devices that serve... Learn More
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Differential Amplifier Chips - (36 companies)Differential amplifier chips are designed to amplify the difference between two input signals. They can amplify a small difference between two signal levels and ignore any common level shared between them. This is particularly useful when the signal... Search by Specification | Learn More
Product News for BGA rom 102 chip
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TRINAMIC Motion Control GmbH & Co. KG.
TMCM-1021-axis stepper controller/driver 3.5A/48V with encoder interface. The TMCM-102 is a single axis 2-phase stepper motor controller and driver module with an aluminium profile for quick and robust mounting. The built in encoder feedback makes it an optimum solution for high-reliability drives. This drive is optimally suited for industrial high-reliability applications. The power stage has very low dissipation when compared to competitors' products. Its interface add-on board concept allows... (read more)
Browse Stepper Motor Drives Datasheets for TRINAMIC Motion Control GmbH & Co. KG. -
Thermshield, LLC
BGA Heat SinksThermshield Ball Grid Array heat sinks and active coolers are available in standard or custom configuration to manage all of your chipset cooling needs. We'll keep your graphics cards, data chips, and CPU's running cool and quiet. (read more)
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Pickering Electronics
SERIES 102 RF SwitchingThe Series 102 is a range of subminiature coaxial reed relays for high frequency applications up to 3 GHz. Two package types are available, both displaying outstanding RF performance in terms of low insertion loss, good isolation and excellent VSWR characteristics in 50 ohms systems. These relays have good coil drive levels making them ideal for portable applications or where space is at a premium. If an even smaller RF relay is required, look at the Series 109RF or 111 RF. 50 Ohms Independence... (read more)
Browse Reed Relays Datasheets for Pickering Electronics -
Advanced Antivibration Components - AAC
New CD-ROM from Advanced Antivibration ComponentsThis CD-ROM Features eStore Interactive Links to over 3,000 Products. A new CD-ROM from Advanced Antivibration Components - AAC features vibration mounts catalogs and eStore Interactive links to over 3,000 products. The CD-ROM, identified as V115, features a wide range of antivibration and shock isolation products which include: stud & nut type mounts, base plate fastened mounts, wheels, leveling & foot mounts, suspension mounts, spring, steel mesh & cable mounts, bumpers, shock... (read more)
Browse Shock Absorbers, Linear Dampers, and Dashpots Datasheets for Advanced Antivibration Components - AAC -
Rotork plc
ROM/RBM Electric ActuatorROM actuators provide quiet and reliable operation for all kinds of small ball valves and butterfly valves, as well as dampers and ventilation louvres. They provide self-locking as standard, local visual indicators and manual override options together with a wide range of voltages. Torque range 35 to 650 Nm (25 to 480 lbf-ft). Efficient yet simple gearing. Wide range of supply voltages available. Single-phase, three-phase and DC options. Watertight IP67 rating. See ROM Range Literature Page... (read more)
Browse Electric Valve Actuators Datasheets for Rotork plc -
Advanced Interconnections Corp.
BGA Socket Adapter SystemAn economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced® molded BGA Socket Adapter System enables the BGA device to be plugged into a mating socket after soldering to a pinned adapter. More Information... Available from 0.50mm to 1.27mm pitch. Protects valuable PC boards and subjects device to lower thermal stress. Same footprint as BGA device. Value-added features such as eutectic SnPb and lead-free SnAgCu solder balls, and tape and reel... (read more)
Browse IC Interconnect Components Datasheets for Advanced Interconnections Corp. -
Advanced Interconnections Corp.
Flip-Top™ BGA SocketAdvanced Interconnections' Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. More information... Features: The compact Flip-Top™ BGA Sockets require no external hold-downs and use less PC board space than most test sockets. The patent-pending pressure retention clamp, with integral heat sink, ensures a reliable connection... (read more)
Browse IC Interconnect Components Datasheets for Advanced Interconnections Corp. -
All Metric Small Parts
aMsp CD-ROM CatalogThe CD-ROM, identified as M101, features all Metric components. The products detailed include: Handles, Handwheels, Cranks, Grips, Levers, Knobs, Latches, Locks, Catches, Hinges, Screws, Washers, Springs, Keys, Plungers, Pins, Leveling & Support Feet. About All Metric Small Parts (aMsp): All Metric Small Parts (aMsp) is a division of Designatronics, Inc. which sells Exclusively Metric and 100% RoHS compliant components. Our product lines, which we manufacture and/or market at the present... (read more)
Browse Leveling Feet, Pads, and Glides Datasheets for All Metric Small Parts -
SAE International
SAE Aerospace Standards on CD-ROMrevisions right from your computer. Display and print an entire standard or select pages. Use cross-reference links to find related information. Receive free technical support from SAE. Search Capabilities. The SAE Aerospace Standards on CD-ROM includes an easy-to-use search engine that will assist in locating the aerospace standards you need. Some of the key search features include: Ability to perform search by document number or keyword. A Field Search form that allows you to search... (read more)
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Coto Technology
BGA Reed Relays Provide Superior RF PerformanceCoto Technology, of Providence, RI, has announced the release of two patented ball-grid-array (BGA) Reed Relays. The B10 and B40 BGA relays utilize breakthrough patented technology to provide leadless relay designs with enhanced RF performance. The signal path in the BGA between input and output is designed as an RF transmission line, with an RF impedance close to 50 ohms throughout the relay. With either B10 or B40 BGA relays, the designer is able to switch or pass signals with wider bandwidth... (read more)
Browse Electromechanical Relays Datasheets for Coto Technology
Engineering Web Search: BGA rom 102 chip
Solid-state drive - Wikipedia, the free encyclopedia
The package included a rechargeable battery to preserve the memory chip contents when the array was not powered.[12 1987 saw the entry of EMC
Features ? Incorporates the ARM920TTM ARM? Thumb? Processor ?...
Channel ? Mid-level Implementation Embedded Trace MacrocellTM (256-ball BGA Package only) ? Low Power: On VDDCORE 24.4 mA in Normal Mode, 520 ?A in
See Atmel Corporation Profile & Catalog
6430DS.fm
8 or 16 bits, 2x128 52 LQFP144 2 (8+ 8 SAM3U4E dual plane 96 4 2 Yes 4 chip selects, 8 bits Kbytes Kbytes BGA144 channels) 24-bit address 8 or 16
See Digi-Key Corporation Profile & Catalog
Arria II GX FPGA Development Kit, 6G Edition
102,600 adaptive logic modules (ALMs) 11,756 Kb on-chip memory
See Altera Corporation Profile & Catalog
Stratix Device Handbook, Volumes 1 & 2
2?122 Differential On-Chip Termination ............................................................................................. 2?127 MultiVolt
See Altera Corporation Profile & Catalog
TMS320VC5407/TMS320VC5404 Fixed-Point Digital Signal...
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.2 On-Chip ROM With Bootloader . . . . . . . . . . . . . . . . . . . . . . . . . . .
See Digi-Key Corporation Profile & Catalog
TMS320F2809, F2808, F2806, F2802, F2801, C2802, C2801,...
35 3.2.6 ROM .............................................................................................................. 35 3.2.7 M0, M1 SARAMs
See Digi-Key Corporation Profile & Catalog
TMS320F2810, TMS320F2811, TMS320F2812, TMS320C2810,...
34 3.2.7 ROM (C281x Only) ............................................................................................. 34 3.2.8 M0, M1 SARAMs
See Newark Profile & Catalog
TMS320VC5402A Fixed-Point Digital Signal Processor (Rev. F
18 3.2 On-Chip ROM With Bootloader........................................................................................... 18 3.3 On-Chip RAM
See Newark Profile & Catalog
ADSP-21991 Mixed Signal DSP Controller, Revision 0
Words of On-Chip RAM, Configured as 32K Words Dedicated 32-Bit Encoder Interface Unit with On-Chip 24-Bit Program RAM and 8K Words On-Chip Companion
See Analog Devices, Inc. Information